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Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding image 1Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding image 2Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding image 3Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding image 4Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding image 5Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding image 6

Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine, Silicon Wafer Grinding and Polishing, Silicon Wafer Grinding

Shenzhen Ponda Grinding Technology Co.,Ltd.

Price $20000.00 / Piece
Mini Order
-+Subtotal: $20000
Availability In Stock
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Model NO.
380
Certification
ISO 9001
Condition
New
Service
Oversea Setup & After-Sale Avalaible
Class
Grinding
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
After-sales Service:
Engineers Available to Service Machinery Overseas
Type:
Surface Grinding Machine
Processing Object:
Shenzhen Pangda Laboratory High Precision Silicon
Abrasives:
Grinding Wheel
Controlling Mode:
CNC
Precision:
High Precision
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine
Working principle:
1. The grinding machine is a precision grinding and polishing equipment, the grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure on the workpiece, the workpiece and the grinding disc for relative running friction, to achieve the purpose of grinding and polishing.
2. The dressing mechanism of the grinding disc adopts the hydraulic suspension guide rail to move back and forth, and the diamond trimming knife trims the grinding surface of the grinding disc precisely to obtain the ideal plane effect.


Special points:
1. Usually, the traditional way of polishing plate is to use electroplate wheel to trim, which is not ideal. The error will be tens of microns or even hundreds of microns, through the dressing machine, grinding disc flatness can reach ±0.002mm. The flatness of the workpiece after processing can reach ±0.0005mm (φ50mm).
2. A series of grinding machine parts are pressurized by pressing the weight block.


APPLICATION
ProcessIndustry by SubstanceIndustry by Applicability
High
Speed
Grinding
& Thinning
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealingsealing ring(liquid, oil, gas)
Semiconductorsubstrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
PlasticHard Plastic
Optics(flat)optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstonejade, sapphire, agate, etc.
Othersgauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Standard Specification
Machine ModelFD170TFD220TFD320TFD450T
Station DiameterΦ150 mm / 6 inchesΦ220 mm / 8 inchesΦ320 mm / 12 inchesΦ460 mm / 18 inches
Max. Workpiece DimensionΦ150×30 mmΦ220×50 mmΦ320×50 mmΦ460×50 mm
Process Thickness50μm≤N75μm≤N95μm≤N120μm≤N
Grating Resolution0.5 μm0.5 μm0.5 μm0.5 μm
Number of Station1111
Wheel Rotate Speed0-3000 rpm0-3000 rpm0-3000 rpm0-3000 rpm
Station Rotate Speed0-300 rpm0-300 rpm0-300 rpm0-300 rpm
Total Weight650 kg850 kg900 kg920 kg
Total Floor Space1200×550 mm1150×1200 mm1150×1200 mm1150×1200 mm
Built-In Optional Kits
GradeStandardAdvanced
Slurry Recycle System-Integrated with PLC
Dressing System-Integrated with PLC
Station FixingMechanical FixturePneumatic Vacuum Fixing
SpindleMechanicalPneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)
Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine

Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine
Patent
Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine

About the Company

Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine

Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and itssupporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers45 people

Delivery & Packing

Packing Details  : Packing, 1 pcs/carton.
Shenzhen Pangda Laboratory High Precision Silicon Wafer Grinding and Polishing Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.

Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries. 

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