Model NO.
JJBP-0121-0016
Flexural Strength
>800MPa
Dielectric Constant
33MHz
Dielectric Loss Angle
≦16MHz
Customized Service
OEM, ODM, Prototyping, Trial Order Supported
Transport Package
Individual Package
Specification
Standard or Customized
Trademark
JingHui
Origin
China
HS Code
8547100000
Type:
Ceramic Substrate
Forming Method:
Tape Casting
Features:
High Flexural Strength and Wear Resistance
Usage:
Blank Ceramic Circuit Board
Optional Color:
White, Yellow, Black, Blue
Density:
Over 6.0g/cm3
High Flexural Strength Precision Polishing ZrO2 Wafer Zirconia Ceramic Substrate
Introduction of Zirconia Ceramic Substrates
In terms of functional ceramics, zirconia ceramic substrates are used as induction heating tubes, refractory materials, and heating elements due to their excellent high temperature resistance.
Zirconia ceramics have sensitive electrical parameters, high toughness, high flexural strength and high wear resistance, excellent heat insulation performance, and the thermal expansion coefficient close to that of steel. They are mainly used in oxygen sensors, thermal substrates for fuel cells, solid oxide fuel cells and high temperature heating elements and other fields.
Why Polished?
Three major benefits of lapping and polishing for the ceramic substrate:
1. A finer pattern can be obtained.
2. Better parallelism of the upper and lower surfaces (thickness tolerance) can be achieved.
3. A thinner metallization layer can be acquired.
Three major benefits of lapping and polishing for the ceramic substrate:
1. A finer pattern can be obtained.
2. Better parallelism of the upper and lower surfaces (thickness tolerance) can be achieved.
3. A thinner metallization layer can be acquired.
Material Properties of Zirconia Ceramic Substrates
| Zirconia Ceramic Substrate | ||
| Item | Unit | ZrO2 |
| Mechanical Properties | ||
| Color | / | White |
| Density | g/cm3 | ≥6 |
| Water Absorption | % | 0 |
| Vickers Hardness (Load 4.9N) | Gpa | 11 |
| Young's Modulus | GPa | 200 |
| Flexural Strength | Mpa | >800 |
| Fracture Toughness | MPa·m1/2 | 5.0 |
| Thermal Properties | ||
| Max. Service Temperature (Non-loading) | ºC | 1000 |
| CTE (Coefficient of Thermal Expansion) (20-800ºC) | 1×10-6/ºC | 7.8 |
| Thermal Shock Resistance | ≥10 Times | No Crack |
| Thermal Conductivity (25ºC) | W/m·K | >3 |
| Specific Heat (25ºC) | J/kg·K | 460 |
| Electrical Properties | ||
| Volume Resistivity (25ºC) | Ω·cm | ≥1013 |
| Dielectric Strength | KV/mm | ≥10 |
| Dielectric Constant (25ºC, 1MHz ) | (E) | 33 |
| Dielectric Loss Angle (25ºC, 1MHz ) | ×10-4 | ≤16 |
Production Process of Zirconia Ceramic Substrates
Product Inspection
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